Services
服务
From design readiness to production continuity.
从设计准备到持续量产。
A practical operating model for semiconductor projects that require coordinated engineering, commercial and manufacturing execution.
面向需要工程、商务与制造协同执行的半导体项目，提供务实的一体化服务模式。
A
Technology Selection
工艺选择
Requirement review, process comparison and path-to-tape-out planning.
需求评估、工艺比较及流片路径规划。
B
PDK / IP Coordination
PDK / IP 协调
Access workflow, technical communication and design enablement coordination.
接入流程、技术沟通及设计赋能协调。
C
Tape-out & MPW
Tape-out 与 MPW
Schedule alignment, submission readiness and fabrication follow-through.
排期协调、提交准备及制造过程跟进。
D
Production Management
量产管理
Wafer starts, WIP tracking, forecast alignment and delivery coordination.
晶圆投片、WIP 跟踪、预测对齐及交付协调。
E
Assembly & Test
封装与测试
Back-end sourcing, test-flow coordination and qualification support.
后道资源、测试流程协调及可靠性认证支持。
F
Quality & Failure Analysis
质量与失效分析
Issue triage, cross-vendor coordination and structured closure of technical problems.
问题分流、跨供应商协调及技术问题闭环。
Typical engagement
典型项目流程
Define定义Product, node, volume, schedule and constraints.明确产品、节点、数量、时间表及限制条件。
Enable赋能PDK, IP, quotation and technical readiness.完成 PDK、IP、报价及技术准备。
Execute执行Tape-out, fabrication, assembly and test.完成 Tape-out、制造、封装与测试。
Scale量产Production ramp, quality and supply continuity.支持产能爬坡、质量与供应连续性。